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JONES TECH Thermal Gel 21-335 Prostech Vietnam

JONES TECH Thermal Gel 21-335

  • Product code: 21-335
  • Manufacturer: Jones Tech
  • Package size:
  • Shelf Life:
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21-335 Series is Two-Part Thermal Gel with low viscosity, silicone putty thermal gap filler in which is cured in room temperature. It is designed to be used where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink.

Key Features

  • Extreme Low stress induced during assembly
  • Easy for rework
  • Easily dispensable
  • Cured in room Temperature
  • Electrically Isolating
  • Low Thermal Resistance

Applications

  • Smart device/phone
  • Cooling components to chassis, frame, or other mating components
  • Memory modules
  • Home & Small Office Network
  • Mass Storage Devices
  • Automotive Electronics
  • Telecommunication Hardware
  • Radios
  • LED Solid State Lighting
  • Power Electronics
  • Set Top Boxes
  • Audio & Video Component
  • IT infrastructure
  • GPS navigation and other portable
    devices

 

 

 

PropertyValue 
Thermal Conductivity (W/m-K)3.2
Thermal Resistance (°C.cm^2/W)@ 1mm3.05
Color/ Part AGreen
Color/ Part BLight grey
Before Cure520,000 
Viscosity as mixed (mPa-s)500,000
Mix Ratio1:1
(Cured) ColorGreen
Tensile lap-shear strength
(psi)		18
Density (g/cc)3.0
Hardness (Shore OO)50
Breakdown Voltage(kV/mm)>6
Volume Resistivity (ohm-cm)>10^12
Dielectric Constant @10MHz4.9
Operation Temperature Range(°C)-40~150
Pot Life @ 25 °C (min)120
Cure @ 25 °C (hrs)18
Cure @ 100 °C (min)20

 

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