Product Introduction
HumiSeal® 1C51 is a fast-curing, low-viscosity silicone conformal coating optimized for dipping and spraying applications on PCBs.
HumiSeal® 1C51 Features:
- Fast thermal curing (10-15 min @ 105-130°C)
- Low viscosity (630 ± 150 cps) for easy application
- Contains optical brightener for UV inspection
- MIL-I-46058C qualified and RoHS compliant
- Excellent flexibility and V-0 flammability rating
Applications:
- High-volume PCB production requiring fast curing
- Applications demanding precise coating application
- Environments requiring UL-recognized materials (E105698)
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
Property | Value |
---|---|
Density, per ASTM D1475 | 0.99 ± 0.01 g/cm³ |
Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044 | 98% |
Viscosity, per Fed-Std-141, Meth. 4287 | 630 ± 150 centipoise |
VOC | 0 grams/litre |
Recommended Coating Thickness | 50 – 200 microns |
Recommended Curing Conditions | 10 – 15 minutes @ 105 – 130°C |
Time Required to Reach Optimum Properties | 15 minutes |
Recommended Stripper | HumiSeal® Stripper 1091 |
Shelf Life at Recommended Conditions, DOM | 12 months |
Thermal Shock, 50 cycles per MIL-I-46058C | -65°C to 200°C |
Glass Transition Temperature – DSC | < -65°C |
Coefficient of Thermal Expansion – TMA | 296 ppm/°C |
Modulus – DMA | 46 MPa @ -40°C 3.9 MPa @ 25°C 3.3 MPa @ 80°C |
Flammability, per UL 94 | V-0 |
Dielectric Withstand Voltage, per MIL-I-46058C | >1500 volts |
Dielectric Breakdown Voltage, per ASTM D149 | 7000 volts |
Dielectric Constant, at 1MHz and 25°C per ASTM D150-98 | 2.4 |
Dissipation Factor, at 1MHz and 25°C per ASTM D150-98 | 0.01 |
Insulation Resistance, per MIL-I-46058C | 5.0 x 10¹⁴ ohms (500TΩ) |
Moisture Insulation Resistance, per MIL-I-46058C | 1.0 x 10¹⁰ ohms (10GΩ) |
Fungus Resistance, per ASTM G21 | Passes |