High Conductivity TC1050* Heat Spreader

TC1050 heat spreader consists of a TPG* core encapsulated within a structural shell. The TPG provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common Encapsulation Materials include:
– Aluminum (TC1050.AL)
– Copper (TC1050.CU)
– Other available encapsulations and systems include Kovar, WCu, MoCu, AlSiC, stainless steel, Ni, carbon fiber, etc.

FEATURES:

•  Thermal conductivity 5x of aluminum and 3x of copper
•  Low thermal interface resistance
•  Lighter than aluminum
•  Adjustable coefficient of thermal expansion
•  Wide operating temperature range
•  Mechanical load bearing
•  Hermeticity higher than 10-8 atm.cc/s
•  Vibration and shock resistance
•  Machinable
•  Platable
•  Size up to 4 ft2 (0.37 m2)

APPLICATIONS:

• Heat spreader in electronic packaging
•  Thermal cores for PWB’s
•  Finned heat sinks
•  Avionic thermal cores
•  Satellite traveling wave tube (TWT) mounts
•  Electronic chassis
•  Cold plates in radar systems