Everwide JE884 Die-Attach Adhesive

Product Description

• This advanced one-component acrylic resin adhesive, from Everwide, is engineered for rapid curing at elevated temperatures, significantly streamlining assembly processes and boosting production efficiency.
• It forms exceptionally strong structural bonds and maintains outstanding dimensional stability, critical for reliable long-term performance in sensitive electronic components.
• Designed with high thixotropy and no stringing, this versatile product allows for precise application across a wider range of challenging electronic assembly areas, including underfill.
• The cured surface is non-oily and provides excellent insulation properties, while also boasting a high Tg and minimal shrinkage, ensuring consistent performance.
• This adhesive fully complies with the strict 2011/65/EU RoHS regulations and maintains ultra-low halogen content, making it suitable for environmentally conscious designs.

Key Features

• Hardened surface free from oiliness, exhibiting insulation properties.
• No stringing observed and high thixotropy for versatile application.
• High glass transition temperature (Tg) and low shrinkage, ideal for underfill.
• Complies with 2011/65/EU RoHS regulations.
• Meets stringent halogen-free requirements (chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm).