Everwide JA 447-26 Non-reactive Silicone System Thermal Gel

Product Description

• This Everwide chemical formulation introduces a high-viscosity, solvent-free, non-reactive silicone thermal paste.
• Engineered to provide exceptional electrical insulation alongside superior thermal conductivity, perfect for diverse electronic components.
• Its unique composition ensures it remains consistently non-hardening and will not dry out over time, facilitating easy reworkability and stripping without issue.
• Offers versatile application across various devices, including flip chips, BGAs, diodes, power switches, and transistors, for effective thermal management.
• Designed to perform reliably even after extensive periods, maintaining its pliable consistency and robust properties.

Key Features

• Formulation contains no conductive metals.
• Offers excellent electrical insulation coupled with superior thermal conductivity.
• Optimized for applications where the gap is less than 1mm.
• Easily cleanable with isopropyl alcohol.
• Features a wide operating temperature range from -40 to 180 °C.
• Suitable for both dispensing and steel plate printing methods.
• Complies with the 2011/65/EU RoHS regulations.
• Resistant to sagging at elevated temperatures and exhibits low exudation.