Everwide Chemical JE277 Two Component Thermally Conductive Adhesive

Product Description

• This specialized Everwide Chemical formulation is a two-component epoxy resin, engineered for superior thermal conductivity in demanding applications.
• Designed with low thermal stress, this adhesive ensures excellent durability, consistently passing rigorous environmental tests for long-term reliability.
• It exhibits exceptional resistance to both cold and heat shock, making it an ideal solution for robust packaging of diverse electronic components and modules.
• After curing, the resin provides strong adhesion combined with remarkable resistance to oleochemicals and various solvents, maintaining structural integrity.
• This solvent-free system offers good processability and also possesses excellent electrical insulation properties, adhering to RoHS regulations.

Key Features

• Solvent-free, two-component epoxy resin system
• Non-greasy cured surface
• High bonding strength
• Excellent electrical insulation properties
• Good processing viscosity
• Superior chemical resistance
• RoHS compliant (2011/65/EU)