Everwide Chemical JE240 Epoxy for Potting and Bonding

Product Description

• A high-viscosity, two-component epoxy resin from Everwide Chemical.
• This formulation is engineered to achieve full curing efficiently even at lower temperatures, while providing excellent handling characteristics.
• Once cured, the material delivers outstanding toughness, robust electrical insulation, and superior impact resistance, ensuring component protection.
• Perfectly suited for a wide array of electronic component applications, including robust bonding, precise caulking, protective potting, and complete encapsulation.
• Exhibits remarkable resilience against various aggressive chemicals and solvents, contributing to enduring performance in challenging environments.

Key Features

• Cured product resists moisture absorption and caking.
• Excellent chemical and solvent resistance.
• Cured surface free from oiliness and maintains good gloss.
• High post-cure toughness and shock resistance.
• Superior bonding to general glass, ceramics, and metals.
• RoHS compliant (2011/65/EU).