Everwide Chemical FX 196G3

Product Description

• This advanced bonding solution is a one-component, moisture-curing silicone thermal adhesive engineered by Everwide Chemical.
• It provides exceptional adhesion and sealing capabilities for diverse materials, including plastics, metals, and glass substrates, without the need for a primer.
• The unique dealcoholized curing mechanism eliminates harsh odors, avoiding issues associated with PU isocyanates or deoximation/deacidification processes, ensuring a safer application.
• Formulated for convenient manufacturing processes, this non-sagging paste rapidly cures in ambient air to form a tough, long-lasting bond.
• Boasting high thermal conductivity and robust resistance to weather and yellowing, it’s perfect for FIPG applications in electronics and general assembly, also compliant with RoHS regulations.

Key Features

• One-component, dealcoholized sealant formulation
• Achieves fast cure in ambient air with a 5-minute tacky time
• Non-sagging paste consistency, ideal for FIPG applications
• Delivers excellent adhesion strength to metals and various plastics without primer
• Ensures no harmful gas corrosion or damage to bonded materials
• Offers broad material compatibility with no catalyst poisoning concerns
• Cured product is tough and withstands long-term compression
• Exhibits superior weather and yellowing resistance
• Fully complies with 2011/65/EU RoHS regulations