Everwide FD 203-1 UV / Moisture Dual Photo-curing Adhesive

Product Description

• This specialized adhesive from Everwide Chemical offers a pioneering dual-curing mechanism, utilizing both UV light and ambient moisture to ensure comprehensive hardening.
• It is specifically engineered for robust reinforcement and encapsulation in the electronic industry, particularly for connecting PVC, PET, or PI with metal components.
• The innovative moisture-curing feature meticulously addresses shadowed areas, guaranteeing no unreacted monomer remains to compromise electrical performance.
• Designed for mass production, its rapid curing properties significantly enhance manufacturing efficiency while providing excellent flexibility and impact absorption.
• Compliant with stringent RoHS regulations, this product delivers exceptional water resistance and a broad operational temperature range for diverse applications.

Key Features

• Dual UV and moisture curing mechanism
• Suitable for various plastics bonding
• Excellent water resistance properties
• Flexible and capable of absorbing impact fracture energy
• Wide operational temperature range (-45°C to 200°C)
• Complies with 2011/65/EU RoHS regulations