ES3501 One Component Epoxy Adhesive

Product Description

• This advanced, single-component epoxy adhesive is expertly formulated for precise bonding in electronic devices, simplifying operations for manufacturers.
• Designed to deliver tough, strong structural bonds, it boasts exceptional shear, peel, and impact resistance for long-lasting reliability.
• Achieve rapid curing at elevated temperatures, significantly reducing processing times and enhancing overall production efficiency.
• Ideal for a wide array of electronic components, this resin excels in casting, sealing, and demanding BGA/CSP underfill applications.
• Manufactured to high standards, it exhibits remarkable durability, passing numerous environmental tests, and adheres to stringent RoHS and halogen-free regulations.

Key Features

• Solvent-free, non-volatile system ensuring no toxic volatilizations.
• Low viscosity with excellent fluidity for effortless application and suitability for casting.
• Hardening surface maintains a flawless finish, free from oiliness or poor gloss.
• Fully compliant with 2011/65/EU RoHS regulations.
• Meets stringent halogen-free requirements (Chlorine < 900ppm, Bromine < 900ppm, Cl+Br < 1500 ppm).