ES3500 One Component Epoxy Underfill

Product Description

• This specialized one-component epoxy resin is meticulously formulated for robust bonding and underfill applications in diverse electronic devices, ensuring reliable performance.
• Engineered to excel in underfilling BGA and CSP chips, it effectively buffers expansion and contraction stresses on solder ball contacts, providing critical protection during drop tests.
• A solvent-free, low-viscosity adhesive, it boasts exceptional fluidity and rapid high-temperature curing, significantly reducing operational time while boosting manufacturing efficiency.
• Developing tough, structural bonds, this advanced resin delivers outstanding shear, peel, and impact strength, coupled with high durability validated through numerous environmental tests.
• This versatile epoxy is also ideal for various potting, casting, and sealing applications, offering excellent rebound, fatigue, and crack resistance crucial for high-reliability components.

Key Features

• Completely solvent-free composition with no volatile organic compounds released.
• Exhibits low viscosity and outstanding flow characteristics for easy application.
• Cures to a hard surface without developing oiliness or poor gloss.
• Shows excellent reactivity at temperatures exceeding 150°C.
• Provides superior resistance to rebound, fatigue, and cracking.
• Complies with the 2011/65/EU RoHS regulations.
• Meets halogen-free requirements: Chlorine < 900ppm, Bromine < 900ppm, Chlorine + Bromine < 1500 ppm.