ES3405 Epoxy Encapsulating Adhesive

Product Description

• This advanced ES3405 epoxy resin system is engineered for electronic applications, providing versatile encapsulating, casting, and sealing capabilities.
• Achieve superior production efficiency with its fast high-temperature curing properties, significantly reducing working times.
• Experience exceptional structural integrity and longevity, as this adhesive forms a strong, durable bond with outstanding shear, peel, and impact resistance.
• Designed as a one-component, solvent-free system, it boasts low viscosity for easy application and ensures a smooth, non-oily finish post-cure.
• Benefit from its remarkable resilience, offering high rebound, fatigue, and crack resistance to withstand rigorous environmental conditions and allow for reworkability.

Key Features

• One-component epoxy resin system
• Solvent-free and non-volatile formulation
• Low viscosity with excellent fluidity
• Hardened surface maintains a smooth finish
• High rebound, fatigue, and crack resistance
• Fast curing at elevated temperatures
• Versatile and reworkable for electronic products
• Passes rigorous environmental tests