ES3404 Single-part Epoxy for Chip Encapsulation

Product Description

• This is a one-component epoxy adhesive, meticulously formulated for diverse electronic applications, encompassing effective casting and sealing of sensitive components.
• Engineered for rapid curing at elevated temperatures, this advanced material establishes a resilient, exceptionally strong structural bond with a wide array of substrates.
• When specifically employed for chip encapsulation, it deftly buffers the critical expansion and contraction stresses within the bonding joint, ensuring superior long-term reliability.
• The material also plays a vital role in mitigating shear forces generated by reaction during rigorous drop tests, thereby significantly preserving device integrity.
• It rigorously complies with the 2011/65/EU RoHS regulations, demonstrating its commitment to environmental safety and suitability for modern electronic manufacturing processes.

Key Features

• Low viscosity with excellent fluidity for precise application
• A completely solvent-free and non-volatile system, enhancing operational safety
• The hardened surface reliably maintains a clean, high-gloss finish
• Demonstrates remarkable high rebound, fatigue, and crack resistance properties
• Reactive at temperatures exceeding 150°C, suitable for high-speed processing
• Fully compliant with the strict 2011/65/EU RoHS regulations
• Halogen-free, adhering to stringent standards (chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm)