ES3403 One component Epoxy for Electronics Devices

Product Description

• This advanced, one-component epoxy resin is specifically engineered for robust performance in electronic device manufacturing.
• It offers versatile functionality, excelling in applications such as damming, electrical insulation, moisture resistance, comprehensive encapsulation, and secure bonding.
• Boasting superior adhesion strength, excellent resistance to grease, and outstanding chemical and solvent resistance, this resin ensures long-lasting reliability.
• Designed for durability, it consistently passes rigorous environmental tests, maintaining its integrity and performance in challenging conditions.
• With its exceptional characteristics and proven reliability, this high-performance adhesive sees widespread use across diverse electronic fields.

Key Features

• Medium viscosity with good leveling properties, providing a matted surface finish.
• Highly vibration-resistant at ordinary temperatures and exhibits good grinding capabilities.
• Maintains excellent retained strength even after rigorous environmental testing.
• Ensures outstanding dimensional stability across a broad spectrum of temperatures.
• Fully compliant with the 2011/65/EU RoHS regulations.
• Meets strict limits for Chlorine (< 900ppm), Bromine (< 900ppm), and combined Chlorine + Bromine (< 1500 ppm).