ES3400 Single Component Epoxy Encapsulant

Product Description

• This advanced single-component epoxy formulation is meticulously engineered to provide exceptional encapsulation for sensitive electronic devices.
• It forms a remarkably tough and strong structure, delivering outstanding shear, peel, and impact resistance critical for demanding applications.
• Designed for peak performance, this encapsulant demonstrates high durability, consistently passing rigorous environmental stress tests.
• Its solvent-free, non-volatile composition ensures excellent protection, maintaining electrical insulation even under high humidity conditions, and complies with RoHS regulations.
• Offers superior dimensional stability across a wide temperature spectrum and exhibits remarkable resistance to both gaseous and liquid water.

Key Features

• One-component system for simplified application
• Solvent-free and non-volatile formulation
• RoHS 2011/65/EU compliant
• Low halogen content (< 900ppm Cl, < 900ppm Br, < 1500ppm total)
• Outstanding environmental durability and stability
• Excellent retention of electrical insulation properties in high humidity
• Exceptional water resistance in both liquid and gaseous states
• High adhesion strength sustained after environmental testing
• Maintains superior dimensional stability over broad temperature ranges