Product Description of ELANTAS ELAN-Bond MY UF 3031
ELANTAS ELAN-Bond MY UF 3031 is an advanced underfill is a single-component liquid epoxy compound meticulously engineered by ELANTAS Malaysia, optimized for high-performance applications.
Specifically formulated for robust protection and enhanced bonding in Ball Grid Array (BGA), Chip Scale Package (CSP), and Wafer Level Package (WLP) assemblies.
It delivers exceptional adhesive strength and long-term reliability, essential for demanding high-performance electronic devices.
Benefit from accelerated production cycles owing to its rapid curing capabilities, even when processed at lower temperatures.
Key Features
One-component liquid epoxy formulation for streamlined application
Achieves fast cure rates at reduced temperatures, improving throughput
Provides excellent overall reliability and superior adhesive bond strength
Presents in a distinct black appearance
Features an uncured specific gravity of 1.12 ±0.02 at 25°C
Maintains an uncured viscosity between 700 – 1100 cps at 25°C (5rpm)
Offers a practical uncured work life of 48 hours at 25°C
Recommended curing takes 20 minutes at 135°C in a conventional convection oven
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
Provide quotation, sample, TDS/MSDS, and technical consultation
Testing sample quality and verifying product compatibility in our laboratory
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Adapting product sizes, quantities, and packaging to meet specific needs
Offering expert advice on suitable equipment and automation processes
Delivering technical training and on-site support for optimal product use
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