BERGQUIST® GAP PAD® TGP HC5000

Product code: TGP HC5000
Manufacturer: Henkel
Package size:
Shelf Life: 6 months

Highly Conformable, Thermally Conductive, Low-Modulus Material

BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.

FEATURES:

Thermal conductivity: 5.0 W/m-K
High-compliance, low compression stress
Fiberglass reinforced for shear and tear resistance

APPLICATIONS:

Telecommunications
ASICs and DSPs
Consumer electronics
Thermal modules to heat sinks

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Violet	Violet	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.020, 0.040, 0.060 0.080, 0.100, 0.125	0.508, 1.016, 1.524, 2.032, 2.540, 3.175	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	3.2	3.2	ASTM D792
Heat Capacity ( J/g-K)	1.0	1.0	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	35	35	ASTM D2240
Young’s Modulus (psi) / (kPa)	17.5	121	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	5,000	5,000	ASTM D149
Dielectric Constant (1,000 Hz)	8.0	8.0	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	5.0	5.0	ASTM D5470