BERGQUIST® GAP PAD® TGP HC1000

BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable, lowmodulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST® GAP PAD® TGP HC1000 is offered with removable protective liners on both sides of the material.

FEATURES:

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Fiberglass-reinforced for puncture, shear and tear resistance

APPLICATIONS:

• Computers and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• Memory modules and chip scale packages
• CD-ROM and DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FB-DIMM modules