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BERGQUIST GAP FILLER TGF 1450

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  • Manufacturer: Henkel
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A two-part, high performance, thermally conductive liquid gap filling material.

Technology Silicone
Appearance (cured)  Blue
Appearance – Part A  Blue
Appearance – Part B  Light blue
Cure  Heat cure or Room temperature
Application  Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight: Part A: Part B 1 : 1
Mix Ratio by volume: Part A: Part B 1 : 1
Operating Temperature Range -60 to 175ºC
UL Flammability Rating UL 94 V-0

 

FEATURES AND BENEFITS

● Thermal Conductivity: 1.5 W/m-K
● Ultra-conforming with excellent wet-out for near zero interface stress
● No cure by-products
● Low density for weight sensitive application
● Excellent low and high temperature mechanical and chemical stability
● Shear thinning viscosity for ease of dispensing

TYPICAL APPLICATIONS

● Automotive electronics (HEV, NEV, batteries)
● Lighting

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Capillary, ASTM D5099, Pa∙s*:  
   High shear, Shear Rate 3,000 s^-1 30
Viscosity, Parallel Plate, ASTM D2196, Pa∙s*:  
   Low shear, Shear Rate 1 s^-1 200
   Flow viscosity measured on Parallel Plate
rheometer		  
*Part A and B measured separately.
Density, ASTM D792, g/cc		 1.85
Pot life @ 25°C, ASTM D4473, minutes 60

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties  
Hardness, Shore 00, 30 second delay, ASTM D2240 40
Heat Capacity, ASTM D1269, J/g-K 1.0
Electrical Properties  
Dielectric Strength, ASTM D149, V/mil 275
Dielectric Constant, ASTM D150, 1,000Hz 6.4
Volume Resistivity, ASTM D257, ohm-meter 1×10^10
Thermal Properties  
Thermal Conductivity, ASTM D5470, W/(m-K) 1.5

 

 

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