A two-part, high performance, thermally conductive liquid gap filling material.
| Technology | Silicone |
| Appearance (cured) | Blue |
| Appearance – Part A | Blue |
| Appearance – Part B | Light blue |
| Cure | Heat cure or Room temperature |
| Application | Thermal management, TIM (Thermal Interface Material) |
| Mix Ratio by weight: Part A: Part B | 1 : 1 |
| Mix Ratio by volume: Part A: Part B | 1 : 1 |
| Operating Temperature Range | -60 to 175ºC |
| UL Flammability Rating | UL 94 V-0 |
FEATURES AND BENEFITS
● Thermal Conductivity: 1.5 W/m-K
● Ultra-conforming with excellent wet-out for near zero interface stress
● No cure by-products
● Low density for weight sensitive application
● Excellent low and high temperature mechanical and chemical stability
● Shear thinning viscosity for ease of dispensing
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Lighting
TYPICAL PROPERTIES OF UNCURED MATERIAL
| Viscosity, Capillary, ASTM D5099, Pa∙s*: | |
| High shear, Shear Rate 3,000 s^-1 | 30 |
| Viscosity, Parallel Plate, ASTM D2196, Pa∙s*: | |
| Low shear, Shear Rate 1 s^-1 | 200 |
| Flow viscosity measured on Parallel Plate rheometer | |
| *Part A and B measured separately. Density, ASTM D792, g/cc | 1.85 |
| Pot life @ 25°C, ASTM D4473, minutes | 60 |
TYPICAL PROPERTIES OF CURED MATERIAL
| Physical Properties | |
| Hardness, Shore 00, 30 second delay, ASTM D2240 | 40 |
| Heat Capacity, ASTM D1269, J/g-K | 1.0 |
| Electrical Properties | |
| Dielectric Strength, ASTM D149, V/mil | 275 |
| Dielectric Constant, ASTM D150, 1,000Hz | 6.4 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10^10 |
| Thermal Properties | |
| Thermal Conductivity, ASTM D5470, W/(m-K) | 1.5 |
