BERGQUIST GAP FILLER TGF 1450

Product code: 1450
Manufacturer: Henkel
Package size:
Shelf Life:

A two-part, high performance, thermally conductive liquid gap filling material.

Technology	Silicone
Appearance (cured)	Blue
Appearance – Part A	Blue
Appearance – Part B	Light blue
Cure	Heat cure or Room temperature
Application	Thermal management, TIM (Thermal Interface Material)
Mix Ratio by weight: Part A: Part B	1 : 1
Mix Ratio by volume: Part A: Part B	1 : 1
Operating Temperature Range	-60 to 175ºC
UL Flammability Rating	UL 94 V-0

FEATURES AND BENEFITS

● Thermal Conductivity: 1.5 W/m-K
● Ultra-conforming with excellent wet-out for near zero interface stress
● No cure by-products
● Low density for weight sensitive application
● Excellent low and high temperature mechanical and chemical stability
● Shear thinning viscosity for ease of dispensing

TYPICAL APPLICATIONS

● Automotive electronics (HEV, NEV, batteries)
● Lighting

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Capillary, ASTM D5099, Pa∙s*:
High shear, Shear Rate 3,000 s^-1	30
Viscosity, Parallel Plate, ASTM D2196, Pa∙s*:
Low shear, Shear Rate 1 s^-1	200
Flow viscosity measured on Parallel Plate rheometer
*Part A and B measured separately. Density, ASTM D792, g/cc	1.85
Pot life @ 25°C, ASTM D4473, minutes	60

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties
Hardness, Shore 00, 30 second delay, ASTM D2240	40
Heat Capacity, ASTM D1269, J/g-K	1.0
Electrical Properties
Dielectric Strength, ASTM D149, V/mil	275
Dielectric Constant, ASTM D150, 1,000Hz	6.4
Volume Resistivity, ASTM D257, ohm-meter	1×10^10
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K)	1.5