Bectron® PK 5542

Bectron® PK 5542 is a one component resin system which cures to form a soft polyurethane duroplastic with high thermal resistance. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including some thixotropic character while maintaining superior tem- perature resistance & stability.

Heating the resin releases the encapsulated polyiso- cyanate resulting in a polyaddition reaction to give a soft duroplastic cured material.

APPLICATIONS

The cured Bectron^® PK 5542 is a soft duroplastic suitable for chemical, shock and vibration protection of delicate components exposed to high temperature conditions.
Bectron^® PK 5542 is used for the partial or selective coating of SMDs and other components groups on printed circuit boards and ceramic substrates. It can also be applied as a casting/potting resin for elec- tronic components and sensors, automotive electron- ics, plugs etc, up to temperature of 150°C
The viscosity is moderate with slight thixotropic prop- erties for selective thick coating of components or potting of PCB’s or hybrids in housings.

Properties of component as supplied

Property	Condition	Value	Unit
Viscosity, DIN 53019	D=15 s^-1, 23°C	5,000 ± 1,000	mPas
Density, DIN EN ISO 2811-2	23°C	1.40 ± 0.05	g/cm³
Shelf life	23°C	6	months

Thermal properties of cured compound

Property	Condition	Value	Unit
Coefficient of thermal expansion, Beck Test M 56	-20°C to + 90°C	150 x 10^-6	K-1
Thermal conductivity, DIN 52616	23°C	0,35	W/mK

Mechanical properties of cured compound

Property	Condition	Value	Unit
Glass transition temperature, IEC 61006	–	Not measureable	°C
Shore hardness, ISO 868	23°C	70 ± 10	Shore A

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