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Home > Products > By Manufacturer > Elantas > Bectron® > BECTRON® PK 4351 (1 Component, heat-curing)
BECTRON® SA 70P9-60 Silicone Adhesives Prostech Vietnam

BECTRON® PK 4351 (1 Component, heat-curing)

  • Product code: BECTRON® PK 4351
  • Manufacturer: Elantas
  • Package size:
  • Shelf Life: 7 months (23 °C)
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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Introduction
  • BECTRON® PK 4351 Features
  • BECTRON® PK 4351 Applications
  • About Prostech

Product Introduction

BECTRON® PK 4351 is a high-performance, single-component polyurethane system engineered for reliable protection of electronic components under demanding environmental conditions. This black, heat-curing resin offers excellent process convenience due to its ready-to-use formulation and provides robust thermal and mechanical resilience. With a viscosity of 3500 mPas and a Shore hardness of 30 D, it is well-suited for thick film coating and encapsulation applications. BECTRON® PK 4351 cures quickly at +90 °C within 30 minutes, delivering a durable, thermoset finish with a thermal conductivity of 0.3 W/mK, ensuring efficient heat dissipation. Designed to withstand temperatures up to +125 °C over 20,000 hours, this product is ideal for modern electronics requiring superior protection and environmental compliance.

BECTRON® PK 4351 Features

  • One-component, ready-to-use system – no mixing required
  • Heat-curing formulation with rapid cure time (30 minutes at +90 °C)
  • Forms a thermoset polymer with a Shore hardness of 30 D
  • Resistant to thermal cycling between -50 °C and +125 °C
  • Excellent vibration resistance and long-term mechanical stability
  • Glass transition temperature (Tg) below -60 °C for cold environment flexibility
  • Good adhesion to various substrates commonly used in electronics
  • Thermal conductivity of 0.3 W/mK enables moderate heat dissipation
  • Zero VOCs and 100% solids content – environmentally friendly and non-hazardous

BECTRON® PK 4351 Applications

  • Thick film protective coatings on PCBs and hybrid circuits
  • Encapsulation of small electronic components requiring structural reinforcement
  • Dam & Fill applications with wet-on-wet process compatibility
  • Electronic systems exposed to harsh automotive environments
  • Components requiring low-stress, low-exotherm encapsulation
  • Applications demanding stable performance in temperature-extreme conditions
  • Use cases where fast processing and energy-efficient IR curing are beneficial

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
ColourBlack
Viscosity [mPas]3500
Max Temp. [°C/20.000 h]+125 °C
Hardness [Shore]30 D
Cure Speed [min @ +90 °C]30
Thermal Conductivity [W/mK]0.3

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    BECTRON® PK 4351 (1 Component, heat-curing)

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      BECTRON® PK 4351 (1 Component, heat-curing)

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        BECTRON® PK 4351 (1 Component, heat-curing)

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          BECTRON® PK 4351 (1 Component, heat-curing)

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