AOCHUAN TECHNOLOGY TP200-H65-SF Silicon-free Gap Filler Pad

Product Description

• This is a specialized silicon-free thermal conductive pad from AOCHUAN TECHNOLOGY, specifically engineered for critical applications.
• It is particularly designed for environments where organosilicon materials are a concern, offering a high-strength interface.
• The pad ensures excellent thermal conductivity, robust mechanical properties, and superior flame retardancy for diverse demanding uses.
• Built to perform under high compression, it allows for multiple rework cycles and resists tearing, high-frequency vibration, and impact.
• Perfect for demanding applications such as optical fiber modules, medical devices, hard drives, and high-end industrial control systems.

Key Features

• Thermal Conductivity: 2.0 W/m·K
• No silicone oil precipitation or siloxane volatilization
• Good mechanical strength
• Weak initial viscosity, with an option to increase adhesion on one side
• High electrical insulation properties
• UL 94 V-0 Flammability Rating