3M™ Wafer De-Taping Tape 3305

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

FEATURES

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

APPLICATIONS

Wafer De-Taping

Property	Values	Unit	Test Method
Tape Thickness	0.068	mm	JIS Z 0237
Tensile Strength	78.4	N/cm
Elongation	125	%
Adhesion Strength	9.41	N/cm

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