General Description
3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6101 Off-White is a thixotropic, single-component structural epoxy engineered for precision bonding in consumer electronics manufacturing. Its non-sag, medium-viscosity formula (30,000 cP Brookfield) flows readily under application pressure and holds position after dispensing — delivering a uniform, controlled bond line on vertical and complex geometries without slumping or running.
A built-in UV tracer enables instant inline inspection: shine a UV light and the adhesive fluoresces clearly, allowing automated optical inspection (AOI) systems and operators to confirm full coverage before cure. Like all 3M 6100 Series adhesives, 6101 Off-White cures at just 65°C in approximately 20 minutes — a critical advantage over conventional epoxies requiring temperatures above 125°C that can melt plastics, degrade batteries, or demagnetize components. A snap-cure option at 90°C (≈3 minutes) is available for high-throughput lines. Pot life exceeds 4 weeks at room temperature, eliminating the time pressure of two-part systems.
Features & Benefits
- Thixotropic non-sag formula (30,000 cP Brookfield): ideal for bead dispensing and stencil printing on electronics substrates — holds shape on any orientation
- UV tracer for inline inspection: fluorescent under UV light enables 100% coverage verification before thermal cure; reduces rework and scrap
- Low-temperature cure at 65°C (≈20 min): protects heat-sensitive substrates — batteries, polycarbonate, PBT, thin-wall plastics — without thermal damage
- Snap cure at 90°C (≈3 min): increases throughput on heat-tolerant assemblies without compromising final bond strength
- Excellent impact resistance: 2.4 J tensile impact on aluminum with 100% elongation — absorbs drop shock in smartphones and wearables
- Strong adhesion to mixed substrates: 32 MPa (Al-Al), 23 MPa (Al-SUS), proven retention after 36 thermal cycles (-40°C to 85°C) and 72 hours humidity soak
- Screen/stencil printable: suitable for high-volume patterned adhesive deposition on PCBs and electronic housings
- Halogen-targeted compliance (IEC 61249-2-21): supports RoHS/REACH requirements in consumer electronics supply chains
- One-part convenience: no mixing, no pot-life countdown after opening — use directly from 30 mL syringe
Typical Applications
- Structural bonding of smartphone and tablet housing components
- PCB component bonding and circuit protection
- Wearable electronic device assembly
- Screen printing and stencil printing of adhesive patterns on electronics
- Fine-bead dispensing for small electronic assemblies
- Sensor, camera module, and actuator attachment
属性 | 值 |
成分 | 单组分（1-Part） |
颜色 | 米白色（Off-White） |
粘度（锥板 @ 5 Hz） | 50,000 cP |
粘度（布鲁克菲尔德） | 30,000 cP |
UV荧光示踪 | 有 — 可通过UV灯验证 |
适用期（Pot Life @ 25°C） | > 4周 |
卤素（Cl, Br） | 符合 IEC 61249-2-21（目标合规） |
固化时间 @ 65°C | ≈ 20分钟（DSC测定90%固化） |
固化时间 @ 90°C | ≈ 3分钟（DSC测定90%固化） |
拉伸强度 | 27 MPa（ASTM D638） |
断裂伸长率 | 100%（ASTM D638） |
杨氏模量 | 300 MPa（ASTM D638） |
铝基材拉伸冲击强度 | 2.4 J（落锤测试） |
搭接剪切强度 – 铝/铝 | 32 MPa |
搭接剪切强度 – 铝/不锈钢 | 23 MPa |
搭接剪切强度 – 铝/PC-ABS | 6 MPa |
搭接剪切强度 – 铝/PC | 10 MPa |
搭接剪切强度 – 铝/30%玻纤PC | 15 MPa |
搭接剪切强度 – 铝/50%玻纤聚酰胺 | 9 MPa |
热循环保留率（铝-铝） | 36次循环后100%，-40°C至85°C |
湿热保留率（铝-铝） | 72小时@65°C/90%RH后91% |
施工方式 | 点胶（Dispensing）、喷射（Jetting）、丝网/钢网印刷 |
保质期 | 在-20°C（-4°F）下保存18个月 |
包装规格 | 30 mL注射器 |
