3M™ Copper Foil Tape 1183 is a premium tape featuring a 1.4 mil tin-plated copper foil backing. The tin plating provides excellent resistance to oxidation, making this tape ideal for long-term applications. Crucially, it is also solderable, allowing for direct electrical connections. Its acrylic conductive adhesive ensures a reliable ground path.
1183 Tin-Plated Copper Tape Features:
Backing: 1.4 mil tin-plated copper foil.
Adhesive: Acrylic Conductive.
Total Thickness: 2.6 mils (0.066 mm).
Key Characteristics: Tin-plated for oxidation resistance, solderable surface, conductive adhesive.
1183 Tin-Plated Copper Tape Applications:
Primary Use: Long-term EMI shielding, static charge draining, and grounding.
Specific Use: Applications where wires or components need to be soldered directly to the tape surface.
Ideal For: Creating durable ground planes and shielding in harsh environments.
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Property
Value
Product
1183
Backing
1.4 mil tin-plated copper foil
Adhesive
Acrylic Conductive
Total Thickness mils (mm)
2.6 (0.066)
Features
Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable and easily die cut.
