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Home > Products > By Manufacturer > YINCAE > YINCAE UF 88UL
UF 88UL

YINCAE UF 88UL

  • Product code: UF 88UL
  • Manufacturer: YINCAE
  • Package size:
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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Introduction
  • UF 88UL Key Features
  • UF 88UL Applications
  • About Prostech

Product Introduction

UF 88UL is a super-fast flow capillary underfill designed by YINCAE, capable of flowing into a 10μ gap at room temperature without substrate preheating. This advanced material ensures void-free underfill after cure and allows for easy rework. UF 88UL is versatile, suitable for underfilling chip scale packages, ball grid array devices, package on package, land grid array, and certain flip-chip applications. It also provides bare chip protection in various advanced packages like memory cards, chip carriers, hybrid circuits, and multi-chip modules. Engineered for high-production environments where process speed and mechanical shock resistance are critical, UF 88UL is easily dispensed, minimizes induced stresses, and delivers outstanding reliability, including superior temperature cycling performance and excellent mechanical resistance. Its performance in drop tests shows a two-order-of-magnitude improvement compared to solder paste applications.

UF 88UL Key Features

  • Super-fast capillary flow at room temperature without preheating.
  • Void-free underfill after cure.
  • Easy rework capability.
  • Outstanding reliability performance, including superior temperature cycling.
  • Excellent mechanical resistance and improved drop test performance.
  • Minimizes induced stresses.
  • Compatible with all no-clean fluxes.
  • Friendly, non-toxic material.

UF 88UL Applications

  • Underfill for chip scale packages (CSP).
  • Underfill for ball grid array (BGA) devices.
  • Underfill for package on package (PoP).
  • Underfill for land grid array (LGA).
  • Flip-chip applications.
  • Bare chip protection in memory cards.
  • Bare chip protection in chip carriers.
  • Bare chip protection in hybrid circuits.
  • Bare chip protection in multi-chip modules.

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

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    YINCAE UF 88UL

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      YINCAE UF 88UL

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