Yincae Thermal Interface Material TM-150 is a high-performance solderable conductive adhesive. It offers rapid curing, self-filling, and self-leveling capabilities. This material ensures superior thermal management in critical electronic assemblies. It significantly enhances device reliability and operational longevity.
General Information of Yincae Thermal Interface Material TM-150
Yincae Thermal Interface Material TM-150 functions as a robust solderable conductive adhesive. Its advanced formulation provides exceptional electrical and thermal conductivity. This material eliminates common soldering defects. For instance, it prevents outgassing, die skewing, and solder bleeding. Furthermore, it forms a durable 3D polymer network upon curing. This network protects the soldered interface. Consequently, it ensures consistent performance even in harsh industrial environments. This innovative adhesive technology surpasses traditional conductive adhesives. Yincae Thermal Interface Material TM-150 offers superior performance characteristics. This includes enhanced heat transfer and improved bond integrity. It delivers consistent results under various operational stresses.
Key Features & Technical Benefits
- Exceptional Thermal Conductivity (60 W/mK): This industry-leading thermal conductivity ensures highly efficient heat dissipation. It effectively transfers heat away from sensitive electronic components. This prevents overheating and maintains optimal operating temperatures.
- Rapid Curing (60 seconds at 230°C): This ultra-fast curing profile significantly accelerates manufacturing processes. It reduces cycle times and boosts overall production throughput. This allows for more efficient assembly lines.
- Self-Filling and Self-Leveling Properties: These inherent characteristics simplify the application process. They ensure uniform coverage and eliminate voids at the interface. This creates a consistent, reliable thermal path.
- High Reliability and Low Ownership Cost: This formulation provides long-term operational stability. It exhibits excellent environmental resistance. Consequently, it reduces maintenance expenses and extends product lifespan.
- Superior Adhesion and Bond Integrity: The cured material forms a strong, protective 3D polymer network. This network secures the die attach. It ensures robust performance even in challenging conditions.
Typical Industrial Applications
This formulation is engineered for the following applications:
- Die attach applications in LED manufacturing
- Chip Scale Package (CSP) assembly processes
- Quad Flat Package (QFP) bonding solutions
- High-performance electronic device fabrication
- Power electronics thermal management
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
| Type | Solderable Conductive Adhesive |
| Applying Method | Dispense |
| Curing Conditions | 60 sec, 230°C |
| Viscosity | 800 - 1600 cp |
| C.T.E. | 30 |
| Thermal Conductivity | 60 W/mK |
