Yincae Solderable Conductive Diamond-Filled TM 158D is an advanced die attach material engineered to securely and efficiently bond semiconductor dies to various substrates. This innovative solution ensures exceptional thermal and electrical conductivity, superior adhesion, and long-term reliability, meeting the stringent demands of modern electronic assemblies.
General Information of Yincae Solderable Conductive Diamond-Filled TM 158D
Yincae Solderable Conductive Diamond-Filled TM 158D is part of YINCAE’s advanced die attach materials, specifically formulated for the secure and efficient bonding of semiconductor dies. This material is designed to deliver high thermal and electrical conductivity, excellent adhesion, and long-term reliability, making it ideal for high-performance electronic assemblies. Its diamond-filled composition contributes to its superior thermal management capabilities, while its solderable nature simplifies manufacturing processes by potentially eliminating the need for solder flux and cleaning steps.
Key Features of Yincae Solderable Conductive Diamond-Filled TM 158D
- Diamond-Filled Composition: Utilizes diamond particles to achieve outstanding thermal performance, ensuring efficient heat dissipation.
- High Thermal Conductivity: Offers a thermal conductivity of 60-90 W/mK, crucial for managing heat in high-power applications.
- Solderable and Electrically Conductive: Provides high electrical conductivity and solderability, simplifying assembly and enhancing device performance.
Key Applications
- High-power devices
- LED bonding
- Heat spreader bonding applications
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| Property | Value |
| Type | Diamond-Filled |
| Appearance | Silver |
| Thermal Conductivity (W/mK) | 60-90 |
| Tg (°C) | N/A |
| Application Method | Dispense or print |
| Cure Temperature Range | 150-170°C |
