Yincae Solderable Conductive Adhesive TM-150E is a high-performance material for critical die attach applications. It offers rapid curing, self-filling, self-leveling, and self-soldering capabilities. This advanced adhesive outperforms traditional conductive adhesives (Ag) with superior electrical and thermal conductivity. It effectively eliminates common soldering issues such as outgassing, die skewing, shifting, and solder bleeding. Consequently, it enhances overall manufacturing efficiency and product reliability.
General Information of Yincae Solderable Conductive Adhesive TM-150E
Yincae Solderable Conductive Adhesive TM-150E belongs to YINCAE’s advanced thermal interface materials series. This innovative formulation functions as a rapid-cure, self-filling, self-leveling, and self-soldering adhesive. It is specifically engineered to provide exceptional electrical and thermal conductivity, crucial for modern electronic devices. Furthermore, this adhesive forms a robust and durable 3D polymer network upon curing. This network actively protects the soldered interface. It ensures long-term reliability and stable performance, even when exposed to harsh operational environments. This material represents a significant advancement over conventional conductive adhesives, offering enhanced performance and simplified processing for complex electronic assemblies.
Key Features & Technical Benefits
- Exceptional Thermal Conductivity (60 W/mK): This adhesive achieves industry-leading heat transfer capabilities. It effectively dissipates heat from critical components, preventing thermal degradation.
- Rapid and Versatile Curing: It cures efficiently at 110°C within 15-30 minutes. This enables streamlined manufacturing processes and reduces production cycle times.
- Self-Filling, Self-Leveling, and Self-Soldering Properties: These integrated features simplify application significantly. They ensure consistent, void-free bond lines and reliable electrical connections without traditional soldering.
- High Reliability and Environmental Durability: The cured material forms a protective 3D polymer network. This ensures stable, long-term performance and excellent environmental resistance in demanding applications.
- Elimination of Soldering Defects: This adhesive prevents common issues like outgassing, die skewing, shifting, and solder bleeding. It improves yield and reduces rework.
Typical Industrial Applications
This formulation is engineered for the following applications:
- High-performance LED manufacturing and assembly
- Advanced Chip Scale Package (CSP) integration
- Precision Quad Flat Package (QFP) die attach
- Semiconductor device packaging
- Power electronics modules
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
| Property | Value |
| Applying Method | Dispense |
| Curing Conditions | 15 - 30 min, 110°C |
| Viscosity | 30 - 45 kcp |
| C.T.E. | 30 |
| Features | High reliability, Excellent thermal conductivity |
| Thermal Conductivity | 60 W/mK |
