Yincae NF 158R is an advanced reflowable underfill designed to streamline electronic assembly processes by combining fluxing and underfilling into a single, efficient step. This innovative material from YINCAE ensures superior thermal cycling performance and exceptional mechanical shock resistance, significantly enhancing the reliability and longevity of critical electronic components such as flip chips, chip scale packages (CSPs), and ball grid array (BGA) devices.
General Information of Yincae NF 158R
Yincae NF 158R is engineered as a filled fluxing underfill, providing a robust solution for high-density electronic assemblies. Its unique formulation allows for simultaneous fluxing and underfilling during the soldering process, which drastically reduces manufacturing steps and improves overall throughput. This product, Yincae NF 158R, is particularly well-suited for demanding applications requiring high thermal cycling performance and excellent resistance to mechanical shock, ensuring the integrity of solder joints under various operational stresses. It is compatible with a wide range of substrates and is designed to prevent solder joint deformation, even after multiple reflow cycles.
Key Features of Yincae NF 158R
- Combines Fluxing & Underfilling: Yincae NF 158R streamlines the manufacturing process by performing both functions in one step, optimizing efficiency.
- Strong Thermal Cycling Performance: Ensures long-term reliability and stability of electronic components under varying temperatures.
- Excellent Mechanical Shock Resistance: Provides superior protection against impacts and vibrations, crucial for robust devices.
- High Process Yield: Optimized for efficient production, minimizing defects and maximizing output.
- Good Flowability and Fill: Ensures consistent coverage and void-free underfilling, even in fine pitch applications.
Key Applications
- Flip chips
- Chip scale packages (CSPs)
- Ball grid array (BGA) devices
- Multi-chip modules
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| Property | Value |
| Viscosity | 70-120kcp |
| Curing Conditions | Typical high temperature reflow profile |
| Tg | 125 °C |
| Coefficient of Thermal Expansion (CTE) | 50 ppm/K |
