Yincae EN 158B2 is a high-performance reflowable underfill encapsulant designed to provide superior protection and enhanced reliability for advanced electronic assemblies. This innovative Yincae EN 158B2 solution from YINCAE ensures optimized performance in diverse manufacturing environments, offering robust mechanical protection and streamlined processes for critical components like CSP, BGA, and flip-chip.
General Information of Yincae EN 158B2
YINCAE’s underfills are designed to provide superior protection and enhanced reliability for advanced electronic assemblies, including CSP, BGA, PoP, and flip-chip applications. Our underfills offer a range of solutions from fast-flow capillary underfills to reflowable and non-flow options, ensuring optimized performance in diverse manufacturing environments. YINCAE underfills offer fast room-temperature flow into gaps smaller than 1µm and easily cover large chips up to 100mm x 100mm. They are fully compatible with no-clean flux residues, eliminate the cleaning process, and prevent solder joint deformation even after 5×260°C reflows. Designed for extreme durability, they withstand temperatures over 400°C and as low as -273°C, while minimizing warpage and offering high thermal conductivity. Many formulations combine underfill and fluxing function into a streamlined 2-in-1 or 3-in-1 process, maximizing efficiency, reliability, and providing thermal conductivity. Specifically, Yincae EN 158B2 is categorized as an Underfill Encapsulant, offering a viscosity of 25-45kcp and a Tg of 149°C, making it suitable for a wide range of demanding electronic applications. The robust properties of Yincae EN 158B2 ensure long-term reliability.
Key Features of Yincae EN 158B2
- Extreme Thermal Stability: Operates reliably across a wide temperature range from -273°C to over 400°C, suitable for demanding thermal environments.
- Advanced Mechanical Shock Resistance: Delivers outstanding drop-test performance with durability two orders of magnitude higher than standard solder paste, ensuring superior impact resistance.
- Precise Capillary Flow for Ultra-Fine Gaps: Achieves fast, room-temperature capillary flow, penetrating gaps as small as 10µm without preheating, ensuring complete, void-free underfilling.
Key Applications
- Advanced Electronic Assemblies
- CSP (Chip Scale Package)
- BGA (Ball Grid Array)
- Flip-chip Applications
About Prostech
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| Property | Value |
| Description | Underfill Encapsulant |
| Viscosity | 25-45kcp |
| Curing Conditions | 150°C |
| Tg (°C) | 149 |
| C.T.E | 20 ppm/k |
