Yincae DM 158NN is a high-performance reflowable underfill engineered to deliver superior protection and enhanced reliability for advanced electronic assemblies. This innovative material streamlines manufacturing processes by combining soldering and underfilling into a single step, ensuring robust mechanical protection and exceptional thermal cycling performance for critical components like BGAs, CSPs, and flip chips. The Yincae DM 158NN is designed for optimal efficiency and durability in demanding environments.
General Information of Yincae DM 158NN
YINCAE’s underfills, including Yincae DM 158NN, are specifically designed to provide superior protection and enhanced reliability for advanced electronic assemblies, such as CSP, BGA, PoP, and flip-chip applications. This particular formulation is a reflowable underfill that integrates the soldering and underfilling processes, significantly optimizing manufacturing efficiency. It is fully compatible with no-clean flux residues, eliminating the need for additional cleaning steps and preventing solder joint deformation even after multiple reflow cycles. Yincae DM 158NN is built for extreme durability, capable of withstanding temperatures from -273°C to over 400°C, while minimizing warpage and offering high thermal conductivity.
Key Features of Yincae DM 158NN
- Combined Soldering & Underfilling: Yincae DM 158NN optimizes manufacturing efficiency by integrating soldering and underfilling into a single, streamlined process.
- Enhanced Component Reliability: Provides robust mechanical protection, significantly reducing the risk of solder joint failure even under thermal cycling and mechanical stress.
- Extreme Thermal Stability: Operates reliably across a wide temperature range, from -273°C to over 400°C, making it suitable for the most demanding thermal environments.
Key Applications
- BGA (Ball Grid Array)
- CSP (Chip Scale Package)
- Package-on-Package (PoP)
- Flip Chip applications
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
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| Property | Value |
| Description | Underfill Encapsulant |
| Viscosity | 280-600kcp |
| Curing Conditions | 150°C |
| Tg (°C) | 149 |
| C.T.E | 30 ppm/k |
