Manufacturing and reliability challenges
There are multiple challenges when it comes to wire bond manufacturing and reliability. These challenges tend to be a function of several parameters such as the material systems, bonding parameters, and use environment. Different wire bond-bond pad metal systems such as Aluminum Aluminum (Al-Al), Gold-Aluminum (Au-Al), and Copper-Aluminum (Cu-Al) require different manufacturing parameters and behave differently under the same use environments.
Pre-bonding
The semiconductor component or carrier material’s clean metal surfaces are where wire bonding is best performed. However, surface contamination is a common occurrence that might result in “lifts” or non-stick-on pads (NSOP). Production hiccups, downtimes, and quality flaws result from both situations. Both NSOPS and lifts can be prevented, and the quality improved by applying selective plasma treatment before bonding.
Solution
Plasma Surface Treatment
Key benefits The conductive epoxy adhesive such as epoxy with silver filler can be used to repair the wires by manually dispensing it on the failed extremity of the wire. The rework of such wires requires high dexterity and precision. The extremity of the debonded wire is manually positioned on the desired bonding pad. A drop of conductive epoxy is deposited to wet both the wire and the bond pad to establish an electrical connection. As it is a manual pin transfer process, the dispensed volume was not controlled. The chips then are heated up to 150oºC to cure the adhesive. For detailed information on right products, please contact us through:
Fixing & Rework
