What is die preparation?
Die preparation is the procedure used to separate the wafer into individual dice to prepare it for assembly. Wafer mounting and wafer sawing are the two main steps of this process.
Wafer mounting involves the simultaneous attachment of a wafer and a wafer frame to a wafer or dicing tape.
Wafer Sawing is the process of simulating the wafer into an individual die ready for subsequent assembly.
The die preparing process will be completed in 4 steps:
3. UV irradiation
4. Pick up
After the wafer grinding process, the thickness of the wafers has been reduced, and they are exposed to mechanical loads caused by sawing, manual handling, liquid jets, transport systems, and pick and place equipment. Therefore, decreasing the breakage of the wafer, the unclean dicing process, bubble trapping on the adhesive side of the tape, and scratches on the active side of the wafer are very crucial.
Prostech provides dicing tape which is designed for deep-cutting process of LED modules, various type of chips, camera modules. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off. Another essential function of dicing tape is to reduce the bubble trapping and protect from dust, which might damage the complicated circuits imprinted on a wafer
- High adhesion
- High expandability
- Anti-static and anti-chipping
- UV releasing
- Easy pick up
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