WELDBOND EN21539 is a one-component, epoxy-based encapsulant specifically engineered for the robust protection of bare semiconductor devices. This advanced material boasts excellent workability and superior resistance to moisture and chemical permeation, making it ideal for demanding electronic applications.
WELDBOND EN21539 Key Features
One component, easy for use
High purity
High temperature performance
Excellent chemical resistance
Excellent Moisture resistance
WELDBOND EN21539 Applications
Automotive applications
IC memory cards
Chip Carriers
Chip-on-board
Multi-chip modules
BGA
Pin grid arrays
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
Provide quotation, sample, TDS/MSDS, and technical consultation
Testing sample quality and verifying product compatibility in our laboratory
Customizing material formulas for special applications
Adapting product sizes, quantities, and packaging to meet specific needs
Offering expert advice on suitable equipment and automation processes
Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
