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Ultra Light-Weld 9309-SC – Light Cure BGA Prostech Vietnam

Ultra Light-Weld 9309-SC – Light Cure BGA

  • Product code: 9309-SC
  • Manufacturer:
  • Package size: 30 ml syringe
  • Shelf Life: 7 months

   

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Light Cure BGA, CSP Reinforcement Adhesive with See-Cure Technology

Ultra Light-Weld 9309-SC adhesive cures upon exposure to UV/Visible light and is designed for rapid ruggedization of circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary, including use as an alternative to underfill. Ultra Light-Weld 9309-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Dymax adhesives formulated with See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color changes from blue to clear upon cure.

FEATURES:

  • Blue to Clear upon exposure to UV/Visible light
  • UV/Visible light cure
  • High viscosity
  • Highly thixotropic
  • Adhesion to various PCB substrates
  • Reduces stress on components

APPLICATIONS:

  • Reinforcement of Fine-Pitch or leadless components on printed circuit boards
  • Shock absorption
  • Underfill alternative
Uncured properties      
PropertyValueTest method
Solvent contentNo Nonreactive solventN/A
Chemical classAcrylated urethaneN/A
AppearanceBlue transparent gelN/A
Soluble inOrganic solventsN/A
Density, g/ml1.05ASTM D1875
Viscosity, cP (20rpm)45,000 (nominal)DSTM 502

 

Cured mechanical properties      
PropertyValueTest method
Durometer hardnessD57ASTM D2240
Tensile at break, MPa [psi]22 [3,200]ASTM D638
Elongation at break, %140ASTM D638
Modulus of Elasticity, MPa [psi]163 [23,800]ASTM D638

 

Other cured properties    
PropertyValueTest method
AppearanceClearN/A
Refractive index (20°C)1.50ASTM D542
Boiling water absorption, % (2h)5.1ASTM D570
Water absorption, % (25°C, 24h)3.0ASTM D570
Linear shrinkage, %1.2ASTM D2566

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    Underfills for reinforcing Components on PCBs
    https://prostech.vn/underfills-for-reinforcing-components-on-pcbs/

    What is Underfill? Why underfill?Three types of Underfills 1. Full Underfill2. Corner bonding3. Edge bonding Materials and equipment for Underfill EquipmentMaterials  What is Underfill? 

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