PERMABOND® ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.
FEATURES:
- Excellent adhesive strength
- Excellent resistance to vibration
- Easy to use – no mixing required
- Low viscosity
Chemical Composition | Epoxy Resin |
Appearance | Uncured – white / opaque Cured – translucent |
Viscosity | 1,000-3,000 mPa.s (cp) |
Specific Gravity | 1.2 |