TGZNSG Hybrid Thermal Pad

TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the low thermal resistance in a thermal interface without the mess of grease. TGZNSG consists of a 2-mil aluminium substrate that is coated on each side with specially formulated grease and natural to touch. It offers
very high transfer to devices where gaps of 4 – 6 mil is required to be filled.

FEATURES

• Natural tacky but dry to touch
• Minimal force (<15 psi) for interface contact
• TIM pad with all unique advantages of thermal grease
• Low thermal resistance
• Excellent for cold applications
• Allows for total wetting of microscopic voids
• Can be supplied in rolls or custom die-cuts

APPLICATIONS

• Power modules
• IGBTs, DC-DC converter modules
• Solid state relays, Power MOSFETs and RF components
• Power amplifiers, ASICs and digital components
• Customised heat dissipating surfaces