TECHNOMELT® PA 657 N: Low-Pressure Black Hot Melt Adhesive

TECHNOMELT® PA 657 N BLACK is a one-component Polyamide Hot Melt Adhesive designed to meet low pressure molding process requirements. This product can be processed at low molding pressure due to its low viscosity, allowing encapsulation of fragile components without damage.

Specific Gravity @ 20ºC, g/cm³ 0.98
ISO 1183-1
Softening Point (in glycerine), °C 150 to 165
ASTM E28

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