t-Global Ultra Soft Thermal Pad TG-A6200

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

FEATURES:

• High thermal conductivity
• High compressibility and compliancy
• Natural tack

APPLICATIONS:

• Best for high power applications
• Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
• Hub, DDR ll Module, DVD Applications, Handset applications, etc.