t-Global Ultra Soft Thermal Pad PT-TG-3500F

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

FEATURES:

Very good thermal conductivity
Fiberglass on one side
Non deforming
Electeical insulation

APPLICATION:

Best for high power applications
Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
Hub, DDR ll Module, DVD Applications, Handset applications, etc.

Properties	TG-A3500F	Unit	Tolerance	Test Method
Thermal Conductivity	3	W / mK	±10%	ASTM D5470
Thickness	0.5~ 8.0	mm	–	ASTM D374
Thickness	0.0197~ 0.315	inch	–	ASTM D374
Color	yellow	–	–	Visual
Reinforcement Carrier	Fiberglass	–	–	–
Flame Rating	V-0	–	–	UL 94
Dielectric Breakdown Voltage	>6	KV / mm	–	ASTM D149
Weight Loss	<1	%	–	ASTM E595
Density	2.3	g / cm³	–	ASTM D792
Working Temperature	-50 ~ +150	°C	–	–
Volume Resistance	8×10¹²	Ohm-m	–	ASTM D257
Elongation	80	%	–	ASTM D412
Standard Shape	Sheet ones	–	–	–
Hardness(Silicone side)	30	Shore 00	±15	ASTM D2240

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