Shenmao PF684-S-50 SAC305 Sn/Ag3.0/Cu0.5 Lead-Free BGA Sphere (0.50mm)

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP, and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, and bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s requests for various sizes. BGA Sphere is available for customers’ specifications.

Diameters	0.50mm
Diameters Tolerances	±20 µm
Alloy	Sn/Ag3.0/Cu0.5
Appearance	Bright and shiny surface finishes
Shape	Sphere
Density	7.4 g/cm³ (20℃)
Melting Point	217~219℃
Standard	According to JIS-Z-3282
Storage and Handling	Storage must be in a dry, non-corrosive and shine environment

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