Product description
LiPOLY N-TEM53 Non-Silicone Thermal Conductive RF Absorber Pad is a thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 3.0 W/m*K and dissipates elec- tromagnetic radia- tion rapidly to mitigate against EMI issues.
Features of LiPOLY N-TEM53 Non-Silicone Thermal Conductive RF Absorber Pad
- Thermal conductivity: 3.0 W/m*K
- Excellent absorption characteristics
- Naturally tacky
- Reworkable
Applications of LiPOLY N-TEM53 Non-Silicone Thermal Conductive RF Absorber Pad
- IC, CPU, MOS, LED, M/B, Heat sink
- LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
- DDR II module, DVD applications, Hand-set applications
- 5G base station & infrastructure
- EV electric vehicle
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
PROPERTY | N-TEM53 | TEST METHOD | UNIT |
Color | Dark Gray | Visual | – |
Surface tack 2-side/1-side | 2 | – | – |
Thickness | Customized | ASTM D374 | mm |
Density | 3.9 | ASTM D792 | g/cm³ |
Hardness | 75 | ASTM D2240 | Shore OO |
TML | <0.8 | By LiPOLY | % |
Application temperature | -60~130 | – | °C |
ROHS & REACH | Compliant | – | – |
COMPRESSION@1.0mm | |||
Deflection @10 psi | 8 | ASTM D5470 modify | % |
Deflection @20 psi | 11 | ASTM D5470 modify | % |
Deflection @30 psi | 15 | ASTM D5470 modify | % |
Deflection @40 psi | 21 | ASTM D5470 modify | % |
Deflection @50 psi | 28 | ASTM D5470 modify | % |
EMI Attenuation @1.0mm | |||
EMI attenuation@ 2.4 GHz | 12 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 3.5 GHz | 14 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 5.0 GHz | 29 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 6.0 GHz | 25 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 12 GHz | 60 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 18 GHz | 71 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 28 GHz | 112 | ASTM D4935 modify | dB/cm |
EMI attenuation@ 39 GHz | 68 | ASTM D4935 modify | dB/cm |
ELECTRICAL | |||
Surface resistivity | >10¹¹ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
THERMAL | |||
Thermal Conductivity | 3.0 | ASTM D5470 | W/m*K |
Thermal impedance@10 psi | 0.496 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20 psi | 0.473 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30 psi | 0.452 | ASTM D5470 | °C-in²/ W |
Thermal impedance@40 psi | 0.423 | ASTM D5470 | °C-in²/ W |
Thermal impedance@50 psi | 0.385 | ASTM D5470 | °C-in²/ W |
