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PERMABOND® ET538 Two-Part Epoxy Prostech Vietnam

PERMABOND® ET538 Two-Part Epoxy

  • Product code: PERMABOND® ET538
  • Manufacturer: Permabond
  • Package size: 400ml
  • Shelf Life:

 

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PERMABOND® ET538 is a structural, room temperature curing epoxy adhesive that has excellent adhesion to a wide variety of surfaces such as wood, metal, ceramics and many plastic and composite materials. It exhibits good resistance to petrol, oils and water and has an extended cure time making it suitable for larger applications and batch production processes. Its thixotropic “non-slump” nature makes it suitable for gap filling or vertical application.

FEATURES AND BENEFITS

  • Adhesion to a wide variety of substrates         
  • Full cure at room temperature
  • Easy to apply
  • High shear and peel strength          
  • Good impact strength
  • Good chemical resistance   
  • Non-drip rheology

Physical Properties of Uncured Adhesive

 

ET538 A side

ET538 B side

Chemical

composition

Epoxy Resin

Polyamine

Hardener

Appearance

White

Dark grey

Viscosity @ 25°C

20rpm: 75,000

mPa.s (cP)

2.5rpm: 225,000

mPa.s (cP)

20rpm: 30,000

mPa.s (cP)

2rpm: 60,000

mPa.s (cP)

Specific gravity

1.1

1.4

Typical Curing Properties

Mix ratio

1:1 by volume

100:130 by weight

Maximum gap fill

5 mm 0.2 in

Usable / pot life @23°C

120-150 mins

Handling time @23°C

3-5 hours

Working strength @23°C

24 hours

Full cure @23°C

72 hours

Typical Performance of Cured Adhesive

 

 

 

 

 

 

 

 

Shear strength* (ISO4587)

Mild steel: 25-30 N/mm²

(3625-4350psi)

Aluminium: 22-26 N/mm²

(3190-3770psi)

Stainless Steel: 28-32 N/mm²

(4060-4640psi)

Zinc: 17-20 N/mm²

(2500 – 2900 psi)

Carbon Fibre: 20-24 N/mm²

(2900-3480psi)

FRP Glass/Polyester: 6-8 N/mm²

(870-1160psi)

FRP Glass/Epoxy: 18-22 N/mm²

(2610-3190psi)

Polycarbonate: 3-5 N/mm²

(435-725psi)

PA6 30% filled: 3-5 N/mm²

(435-725psi)

Peel strength

(aluminium) (ISO4578)

60-80 N/25mm (13-18 PIW)

Hardness (ISO868)

70-80 Shore D

Elongation at break

(ISO37)

4-8%

Glass transition

temperature Tg

45-55°C (113-131°F)

Dielectric strength

15-25 kV/ mm

Thermal conductivity

0.55 W/(m.K)

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