Permabond ET5160

Product Description

• A high-performance low-viscosity, two-part epoxy adhesive from Permabond, specifically formulated for reliable potting applications.
• Engineered to facilitate large volume potting by offering an extended open time and generating minimal exothermic heat during the curing process.
• Achieves full cure efficiently at ambient room temperatures, with the flexibility to accelerate curing speed through elevated temperatures.
• Boasts compliance with EU Food Contact regulation 10/2011, broadening its suitability for sensitive industrial and professional uses.
• Designed for robust encapsulation and bonding, providing exceptional performance in diverse industrial environments.

Key Features

• Optimized for large volume potting tasks
• Features a low viscosity for easy application
• Ensures minimal heat generation during cure
• Cures effectively at room temperature
• Complies with EU Food Contact 10/2011 regulations