Permabond ET5160 share Product DescriptionKey Features Product Description A high-performance low-viscosity, two-part epoxy adhesive from Permabond, specifically formulated for reliable potting applications. Engineered to facilitate large volume potting by offering an extended open time and generating minimal exothermic heat during the curing process. Achieves full cure efficiently at ambient room temperatures, with the flexibility to accelerate curing speed through elevated temperatures. Boasts compliance with EU Food Contact regulation 10/2011, broadening its suitability for sensitive industrial and professional uses. Designed for robust encapsulation and bonding, providing exceptional performance in diverse industrial environments. Key Features Optimized for large volume potting tasks Features a low viscosity for easy application Ensures minimal heat generation during cure Cures effectively at room temperature Complies with EU Food Contact 10/2011 regulations
