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PERMABOND® ES578 Single-part, heat-cure Epoxy Prostech Vietnam

PERMABOND ES578 Single-part, heat-cure Epoxy

 

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PERMABOND® ES578 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces, ceramics as well as composite materials. ES578 provides excellent thermal conductivity and bond strength. ES578 was designed for applications requiring heat dissipation such as bonding aluminum heat sinks to ceramic headers. The cured adhesive has been designed to meet the fire retardancy requirements of UL94 V-0.

 FEATURES AND BENEFITS

  • Very good thermal conductivity     
  •  Excellent resistance to vibration      
  • Easy to use – no mixing required      
  • High shear and peel strength
  • High temperature resistanc
  • Good resistance to chemicals      
  • Electrically insulating

Physical Properties of Uncured Adhesive

 

Chemical composition

Epoxy Resin

Appearance

Black

Viscosity @ 25°C

600,000 to 800,000 mPa.s (cP)

Specific gravity

1.6

Typical Curing Properties

 

Flow at high temperature

Flowing

Maximum gap fill

5 mm 0.2 in

 

Cure speed (oven) *

130° C (266°F): 75 minutes 150°C (300°F): 60 minutes

170°C (338°F): 25 minutes

Cure speed (induction)

<3 minutes

Typical Performance of Cured Adhesive

 

Shear strength* (ISO4587)

Steel 27 – 41 N/mm² (4000 – 6000 psi)

Aluminium 17 – 31 N/mm² (2500 – 4500 psi)

Zinc 14 – 27 N/mm² (2000 – 4000 psi)

Hardness (ISO868)

80-85 Shore D

Coefficient of

thermal expansion

45 x 10-6 mm/mm/°C (below Tg)

Thermal conductivity

1.0 W/(m.K)

Dielectric strength

40-45 kV/mm

Glass transition temperature

(Tg – DSC)

 

105°C (220°F)

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