• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
  • en
  • vi
  • cn
Home > Products > By Application > Adhesives > Epoxy Adhesive > PERMABOND® ES569 Single-part, heat-cure Epoxy
PERMABOND® ES569 Single-part, heat-cure Epoxy Prostech Vietnam

PERMABOND® ES569 Single-part, heat-cure Epoxy

  • Product code: PERMABOND® ES569
  • Manufacturer: Permabond
  • Package size: 320mL Cartridge
  • Shelf Life:

 

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering, brazing or welding. ES569 has been designed to be non-sagging, allowing the product to be used in large gaps and on vertical surfaces. It is also ideal for bonding electronic components as it has high wet strength and is non-stringing and produces an excellent drop profile as well as withstanding solder reflow processes.

FEATURES AND BENEFITS

  • Excellent adhesive strength
  • Excellent resistance to vibration     
  • Easy to use – no mixing required      
  • High shear and peel strength
  • High temperature resistance       
  • Good resistance to chemicals       
  • Non-sag, thixotropic

Physical Properties of Uncured Adhesive

 

Chemical composition

Epoxy Resin

Appearance

Black paste

Viscosity @ 25°C

250,000 to 500,000 mPa.s (cP)

Specific gravity

1.2

Typical Curing Properties

 

Flow at high temperature

No flow, high wet strength

Maximum gap fill

5 mm 0.2 in

 

Cure speed (oven) *

130° C (266°F): 75 minutes 150°C (300°F): 60 minutes

170°C (338°F): 40 minutes

Cure speed (induction)

<3 minutes

Typical Performance of Cured Adhesive

 

 

Shear strength* (ISO4587)

Steel 27 – 41 N/mm² (4000 – 6000 psi)

Aluminium 17 – 31 N/mm² (2500 – 4500 psi)

Zinc 14 – 27 N/mm² (2000 – 4000 psi)

FRP Glass/Epoxy 9-11 N/mm² (1300–1600psi)

Carbon Fibre 10-12 N/mm² (1450–1700psi)

Peel strength (aluminium) (ISO

4578)

 

100-120 N/25mm

Hardness (ISO868)

80-85 Shore D

Coefficient of

thermal expansion

90 x 10-6 mm/mm/°C (under Tg)

180 x 10-6 mm/mm/°C (above Tg)

Thermal conductivity

0.5 W/(m.K)

Glass transition temperature (Tg –

DSC)

 

130°C (266°F)

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE Solder Joint Encapsulants SMT 266
    YINCAE Solder Joint Encapsulants SMT 266
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-266/

    Key Features of YINCAE Solder Joint Encapsulants SMT 266Applications for YINCAE Solder Joint Encapsulants SMT 266 Introducing YINCAE Solder Joint

    YINCAE Solder Joint Encapsulants SMT 256
    YINCAE Solder Joint Encapsulants SMT 256
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256/

    Elevate Reliability with YINCAE Solder Joint Encapsulants SMT 256Key Features & BenefitsApplications of YINCAE Solder Joint Encapsulants SMT 256 YINCAE

    YINCAE Solder Joint Encapsulants SMT 256 BC
    YINCAE Solder Joint Encapsulants SMT 256 BC
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256-bc/

    Why Choose YINCAE Solder Joint Encapsulants SMT 256 BC?Key Applications YINCAE Solder Joint Encapsulants SMT 256 BC is a cutting-edge

    YINCAE Solder Joint Encapsulants SMT 138
    YINCAE Solder Joint Encapsulants SMT 138
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-138/

    Key Features of YINCAE Solder Joint Encapsulants SMT 138Versatile Applications YINCAE Solder Joint Encapsulants SMT 138 is a cutting-edge, low-temperature

    Similar Products

    • YINCAE Solder Joint Encapsulants SMT 138

      YINCAE Solder Joint Encapsulants SMT 138

      See details
    • YINCAE Solder Joint Encapsulant Paste SMT 256 ED

      YINCAE Solder Joint Encapsulant Paste SMT 256 ED

      See details
    • YINCAE Ball Attach Adhesive BP 256

      YINCAE Ball Attach Adhesive BP 256

      See details
    • AB Chimie Silicone TSE3941

      AB Chimie Silicone TSE3941

      See details
    PERMABOND® ES569 Single-part, heat-cure Epoxy

      Leave your information via Form, our Technical Support Team will contact you shortly!

      PERMABOND® ES569 Single-part, heat-cure Epoxy

        Leave your information via Form, our Technical Support Team will contact you shortly!

        PERMABOND® ES569 Single-part, heat-cure Epoxy

          Leave your information via Form, our Technical Support Team will contact you shortly!

          PERMABOND® ES569 Single-part, heat-cure Epoxy

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!