PERMABOND® ES562 is a single-part epoxy adhesive which flows like solder when heated during curing. The adhesive has excellent adhesion to metal surfaces and composites. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering or brazing. The adhesive’s low viscosity is such that it self-levels.
FEATURES AND BENEFITS
- Excellent adhesive strength
- Excellent resistance to vibration
- Easy to use – no mixing required
- High shear strength
- Low viscosity, self levelling
- Good resistance to chemicals
Physical Properties of Uncured Adhesive
Chemical composition | Epoxy Resin |
Appearance | White |
Viscosity @ 25°C | 15,000 – 30,000 mPa.s (cP) |
Specific gravity | 1.2 |
Typical Curing Properties
Flow at high temperature | Free flow |
Maximum gap fill | 0.25 mm 0.01 in |
Cure speed (oven) * | 130° C (266°F): 60 minutes 150°C (300°F): 45 minutes 160°C (320°F): 20 minutes |
Cure speed (induction) | <3 minutes |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 20 – 35 MPa (3000 – 5000 psi) Aluminium 14 – 27 MPa (2000 – 4000 psi) Zinc 14 – 27 MPa (2000 – 4000 psi) |
Tensile strength (DIN53504) | 40 N/mm² (5800 psi) |
Hardness (ISO868) | 80-85 Shore D |
E-modulus | 2.1 GPa |
Elongation at break (DIN53504) | <3% |
Coefficient of thermal expansion | 50 x 10-6 mm/mm/°C (below Tg) 165 x 10-6 mm/mm/°C (above Tg) |
Thermal conductivity | 0.25 W/(m.K) |
Glass transition temperature (Tg – DSC) | 115°C (240°F) |
Water absorption (ISO62) | <0.5% (at room temperature) |
