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PERMABOND® ES558 Single-part, heat-cure Epoxy Prostech Vietnam

PERMABOND® ES558 Single-part, heat-cure Epoxy

  • Product code: PERMABOND® ES558
  • Manufacturer: Permabond
  • Package size:
  • Shelf Life:

 

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PERMABOND® ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength. ES558 is ideal for bonding a wide range of materials including metals, ferrites, ceramics and composites.

APPLICATIONS

  • Excellent adhesive strength
  •  Excellent resistance to vibration           
  • Easy to use – no mixing required
  • High shear and peel strength
  • Good impact strength
  • High temperature resistance     
  • Good resistance to chemicals

Physical Properties of Uncured Adhesive

 

Chemical composition

Epoxy Resin

Appearance

Silver-grey

Viscosity @ 25°C

100,000 to 300,000 mPa.s (cP)

Specific gravity

1.5

 

Typical Curing Properties

 

Flow at high temperature

Free flow

Maximum gap fill

0.5 mm 0.02 in

Cure speed (oven) *

130° C (266°F): 75 minutes 150°C (300°F): 60 minutes

170°C (338°F): 40 minutes

Cure speed (induction)

<3 minutes

Typical Performance of Cured Adhesive

 

 

Shear strength* (ISO4587)

Steel 27 – 41 N/mm² (4000 – 6000 psi)

Aluminium 17 – 31 N/mm²

(2500 – 4500 psi)

Zinc 14 – 27 N/mm² (2000 – 4000 psi)

Shear strength steel to

ferrite

>14 N/mm² (>2000 psi) Substrate

failure

Impact Strength (ASTM D- 950)

25-35 KJ/m²

Hardness (ISO868)

80-85 Shore D

E-modulus

3.5 GPa

Elongation at break

(DIN 53504)

<3%

Coefficient of thermal

expansion

45 x 10-6 mm/mm/°C (below Tg)

160 x 10-6 mm/mm/°C (above Tg)

Thermal conductivity

0.9 W/(m.K)

Glass transition

temperature (Tg – DSC))

120°C (250°F)

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